Peroxide mixture distribution in CMP

Chemical mechanical polishing (or grinding) combining chemical reaction and mechanical grinding, is a costly and challenging important nanoscale polishing process.

Polishing done through containing oxidant slurry, the oxidant is usually hydrogen peroxide (H2O2).At the factory before using CMP slurry to mix or diluted.To ensure that the correct mix is crucial, because the mixing effect is directly related to the chemical reaction rate and wafer polishing rate.

CMP peroxide mix and distribution

Use visa, K - PATENTS ® semiconductor refractometer measurement of CMP slurry concentration, can cause scratches the surface of the wafer without situation get the best performance of CMP.
Visa, K - PATENTS ® refractometer semiconductor industry:

• Is a kind of can be used for mixing station integrated process measuring equipment.
• Accurate measurement of raw slurry and mixed slurry concentration of H2O2.
• Is a sustainable, rapid and accurate to determine the composition of the CMP slurry is in line with the requirements of the online equipment.

Pulled by visa application report explains the refractometer installed in the semiconductor industry to recommend position to improve the process to achieve the best performance.

Fill out the form to download application report.

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